Leaks suggest the Magic V3 will be even slimmer than its predecessor, the V2. The reported thickness falls between 6-7mm depending on the rear panel material, making it a significant improvement over the already thin V2 (9.9mm). The weight is also expected to drop, coming in around 220-230 grams compared to the V2’s minimum of 231 grams.
Based on the teasers, the Honor Magic V3 appears to sport a sleek black design with a gold hinge. The phone is hinted to have a triple-lens rear camera system and a hole-punch cutout for the selfie camera.
Under the hood, rumors point to a powerful Qualcomm Snapdragon 8 Gen 1 processor paired with up to 12GB of RAM and 512GB of storage. The battery is also expected to be a decent size at 4,600mAh and support fast charging for added convenience.
While an official release date hasn’t been confirmed, the Honor Magic V3 is anticipated to launch in China sometime during the third quarter of 2024. There’s currently no information regarding a global release.
