Xiaomi has hit a big milestone by completing its first 3nm smartphone system-on-chip (SoC), marking a huge step forward in China’s high-performance semiconductor scene. This new chip promises major boosts in efficiency and processing power, making it perfect for handling tough tasks like AI processing, gaming, and multitasking. By moving to a 3nm process, Xiaomi’s chip tech now stands toe-to-toe with top global players in the mobile processor market, showing China’s growing ability to push forward in advanced semiconductor development.
This 3nm chipset comes equipped with ARM’s newest Cortex-X925 CPU and Immortalis-G925 GPU, set to deliver improved performance and next-level features in Xiaomi’s future flagship devices. Typically, making 3nm chips involves using extreme ultraviolet (EUV) lithography, so the fact that Xiaomi managed to complete this process is impressive and shows their capability to work through technical hurdles. Experts think this chip could not only improve battery life but also support next-gen AI functions and advanced camera tech, making Xiaomi’s upcoming phones more appealing to performance enthusiasts.
Xiaomi plans to roll out this new chip in its flagship phones in 2024. This move should help them go head-to-head with other big names like Apple, Qualcomm, and MediaTek, who are also diving into 3nm chip territory. While this new SoC doesn’t yet have a built-in 5G modem, Xiaomi’s progress in developing custom chips signals their intention to rely less on third-party suppliers.
This achievement is part of a bigger trend in China’s tech world, where companies are doubling down on local research and development amid international trade challenges. Xiaomi’s leap forward could pave the way for more high-performance, homegrown tech solutions and push China’s semiconductor industry even further.
